The following series of photographs show the process of soldering.  Care should be taken not to overheat the PCB or component but they need to reach a suitable temperature for the solder to 'take' to them both to form a reliable connection.



The iron is placed at the junction of the component and the PCB.  Solder at the ready.


A small amount of solder is applied to the iron to assist in the transfer of heat.


The solder is slightly withdrawn.


Solder ready to apply again.


Apply around 1 cm of solder.


Still applying the 1 cm of solder.  The pool of molten solder should be visibly flowing around the component.


Solder is withdrawn just before the iron is removed.

When cool, examine for conductivity.

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