The following series of photographs show the process of soldering. Care should be taken not to overheat the PCB or component but they need to reach a suitable temperature for the solder to 'take' to them both to form a reliable connection.
The iron is placed at the junction of the component and the PCB. Solder at the ready.
A small amount of solder is applied to the iron to assist in the transfer of heat.
The solder is slightly withdrawn.
Solder ready to apply again.
Apply around 1 cm of solder.
Still applying the 1 cm of solder. The pool of molten solder should be visibly flowing around the component.
Solder is withdrawn just before the iron is removed.
When cool, examine for conductivity.